Samsung’s HBM Chips Failing Nvidia Tests Due to Heat: Reuters

Samsung Electronics’ latest HBM chips have yet to pass Nvidia’s tests due to heat and power consumption problems, Reuters reports, citing sources.

• The problems affect Samsung’s HBM3 chips, which are the fourth-generation HBM standard currently most used in graphics processing units for artificial intelligence, as well as fifth-generation HBM3E chips that Samsung and its rivals are bringing to market this year
• Related story: Samsung Replaces Chip Chief After SK Hynix Takes AI Lead (2)

To contact the reporter on this story:
Shinhye Kang in Seoul at skang24@bloomberg.net

To contact the editors responsible for this story:
Yusuke Miyazawa at ymiyazawa3@bloomberg.net

Seyoon ...