Infineon Hit With Patent Suit Over Semiconductor Technology (1)

Chip Packaging Technologies LLC filed a patent infringement lawsuit against Infineon Technologies AG over products incorporating semiconductor packaging technology.

Infineon infringed US Patent Nos. 9,263,299, 9,299,646, 8,258,611, 9,685,351, and 8,394,713, according to a complaint filed Thursday in the US District Court for the Eastern District of Texas.

The accused products include buck regulators, power switches, microcontrollers, step-down converters and power stage lines, Chip said.

Technology protected by the ‘299, ‘611, and ‘351 patents was developed by NXP BV, while Freescale Semiconductor, Inc. developed the methods covered by the ‘646 and ‘713 patents, according to the complaint. Chip ...