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Amkor Wins $600 Million in US Grants, Loans for Chip Packaging

July 26, 2024, 9:00 AM UTC
Mackenzie Hawkins
Mackenzie Hawkins
Bloomberg News

Amkor Technology Inc. is in line to receive $400 million in US government grants and about $200 million in loans for an advanced chip packaging project in Arizona, marking the latest award from a program designed to boost American semiconductor manufacturing.

The funding from the 2022 Chips and Science Act will support Amkor’s $2 billion facility in the city of Peoria, which is estimated to generate about 2,000 jobs. The site is slated to package chips manufactured for Apple Inc. at Taiwan Semiconductor Manufacturing Co.’s sprawling new Phoenix complex.

Read More: Amkor to Invest $2 Billion in Arizona Chip ...



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